Exhibit Profile:
< Assembly Equipment >
Wire Bonders
COG Bonders
Die Bonders
FC Bonders
Ball Mounters
Bump Bonders
TAB Bonders
Lead Processing Machine
Resin Coating Machine
Sealing Equipment
Molding Machines
Dicing Machines
Laser Processors
Other Equipment
< Inspection Equipment / Testers / Measurement >
X-ray Inspection Equipment
Infrared Inspection Equipment
Burn-in Inspection Equipment
Environmental Test Equipment
Optical Microscopes
Thermostatic and Humid Static Testing unit
Ball Vision Inspection Equipment
Other Measurement Machines
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< Packaging Materials / Components >
Packaging Substrates (PCBs, Tape Substrates, Ceramic Substrates, etc.)
Liquid Sealant (Under-fill Materials, ACF, ACP, NCF, NCP)
Sealant (Mould Materials)
Base Core Member
Die Adhesive
Lead Frames
Bonding Wires
Soldering Balls
Plating Materials / Technology
Other Fabrication-related Materials
< Other Packaging Technology >
Wafer Level CSP
Package for LAN Bus
3-Dimentional Packaging
Other QFP, SOP, BGA, MCM, TAB/TCP, etc.
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