|
|
|
|
WWW.ADEPTMKG.COM.HK
sort :
country :
Trade Shows
Japan
 
         Japan - IC PACKAGING TECHNOLOGY EXPO :


Tokyo Japan
Jan 22-24, 2003

 
Category: Assembly Equipment, Inspection Equipment / Testers / Measurement, Packaging Materials / Components, Other Packaging Technology......
 

 

 
Target Visitors: Presidents, Directors, Purchasing Managers.
 

Exhibit Profile:


< Assembly Equipment >
Wire Bonders
COG Bonders
Die Bonders
FC Bonders
Ball Mounters
Bump Bonders
TAB Bonders
Lead Processing Machine
Resin Coating Machine
Sealing Equipment
Molding Machines
Dicing Machines
Laser Processors
Other Equipment

< Inspection Equipment / Testers / Measurement >
X-ray Inspection Equipment
Infrared Inspection Equipment
Burn-in Inspection Equipment
Environmental Test Equipment
Optical Microscopes
Thermostatic and Humid Static Testing unit
Ball Vision Inspection Equipment
Other Measurement Machines



< Packaging Materials / Components >
Packaging Substrates (PCBs, Tape Substrates, Ceramic Substrates, etc.)
Liquid Sealant (Under-fill Materials, ACF, ACP, NCF, NCP)
Sealant (Mould Materials)
Base Core Member
Die Adhesive
Lead Frames
Bonding Wires
Soldering Balls
Plating Materials / Technology
Other Fabrication-related Materials

< Other Packaging Technology >
Wafer Level CSP
Package for LAN Bus
3-Dimentional Packaging
Other QFP, SOP, BGA, MCM, TAB/TCP, etc.

 





Adept Marketing - All Rights Reserved.