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| Exhibition for Electronic Component/Manufacturing & Fiber Optics Communication |
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| Industry Field: |
Electronic Component/Manufacturing & Fiber Optics Communications |
| Publication: |
InterNepcon World Japan |
| Website: |
www.nepconworld.jp |
| Publisher: |
Reed Exhibitions Japan |
| Rep Company: |
Adept Marketing |
| Frequency: |
January per year |
| Circulation: |
Tokyo, Japan |
| Exhibitors: |
Over 1,000 companies |
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| Show Titles: |
INTERNEPCONWORLDAPAN
InterNepcon Japan
Featuring all kinds of materials, equipment and technologies for electronics manufacturing and SMT
Electrotest Japan
Featuring all kinds of test, inspection and measurement systemsfor SMT, IC Packaging and board manufacturing.
IC Packaging Technology Expo(ICP)
Specialised in IC final manufacturing (Assembly, Test & packaging)
Printed Wiring Boards Expo(PWB EXPO)
Featuring all kinds of Printed Wiring Boards, Modular Boards, EMS,up to CAD tools.
Int’l Electronic Components Trade Show(ELE TRADE)
Specialised in conducting business discussions for custom-made,technical consultation and components procurement of all kinds of electronic components and devices.
Fiber Optics Expo (FOE)
Specialised in optical fiber communication. |
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| Concurrent Events |
- InterNepcon Japan/Electrotest Japan Technical Conference
- IC Packaging Technology Expo Technical Conference
- Printed Wiring Boards Expo Technical Conference
- Fiber Optics Expo Technical Conference |
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| Price: |
Raw Space – JPY435,000/booth (3.0m x 2.7m)
Corner Charge – JPY15,000/corner (additional)
Rental Display System |
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(At additional cost. Not included in the space.) |
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- Type A: JPY250,000/booth
- Type B: JPY170,000/booth |
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