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Japan - PRINTED WIRING BOARDS EXPO : |
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Tokyo Japan
Jan 22-24, 2003 |
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Category: |
Printed Wiring Boards, Material for Printed Wiring Boards, Electric Boards Design Tools...... |
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Target Visitors: |
Presidents, Directors, Purchasing Managers. |
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Exhibit Profile:
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< Printed Wiring Boards >
Rigid Printed Wiring Boards
Multi-layered Printed Wiring Boards
Flexible Printed Wiring Boards
Multi-layered Flexible Printed Wiring Boards
Flexible Rigid Printed Wiring Boards
Build-up Printed Wiring Boards
Semiconductors Packaging Printed Wiring Boards (BGA, TAB, MCM)
Optical Printed Wiring Boards
EPD (Embedded Passive Devices)
Other Printed Wiring Boards
< Materials for Printed Wiring Boards >
Paper base / phenolic Copper-clad Laminates
Paper base / epoxy Copper-clad Laminates
Glass / Epoxy Copper-clad Laminates Glass / Polyamide Copper-clad Laminates
Composite Copper-clad Laminates
Flexible Copper-clad Laminates
Other Materials for Printed Wiring Boards
< Electric Boards Design Tools >
PCB/PWB Design CAD Tools
CAM Software
Analyzers (Thermal, Application, EMI,Electricity)
Other Printed Wiring Boards Design Tools
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